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1 of 14 features applications feature of the device: small package with high efficiency typical wavelength: 527nm typical viewing angle: 150 typical light flux output: 60 lm @ 350ma. esd protection. soldering methods: smt grouping parameter: luminous flux, forward voltage and chromaticity. optical efficiency: 48 lm/w. moisture sensitivity level: 3 thermal resistance (junction to heat sink): 15 c /w the product itself will remain within rohs compliant. design and effect illumination interior automotive lighting (e.g. dashboard backlighting) room lighting (e.g. luminaries, spotlights) reading light (aircraft, car, bus) signal and symbol luminaries marker lights (e.g. steps, exit ways, etc.) architectural illumination materials items description housing black body heat resistant polymer encapsulating resin silicone resin electrodes ag plating copper alloy die attach silver paste chip lngan ehp - a x08el / sug01h - p 01 high power led ? 1 w data sheet
ehp-ax08el/sug01h-p01 high power led ? 1 w 2 of 14 dimensions notes. 1. dimensions are in millimeters. 2. tolerances for fixed dimensions are 0.25mm
ehp-ax08el/sug01h-p01 high power led ? 1 w 3 of 14 maximum ratings ( t soldering =25oc ) parameter symbol rating unit dc operating current i f 400 ma pulsed forward current (1) i pf 500 ma esd sensitivity esd 2000 v junction temperature t j 125 c operating temperature t op. -40 ~ +85 c storage temperature t stge. -40 ~ +100 c junction to heat-sink thermal resistance r th 15 c /w electro-optical characteristics ( t soldering =25oc ) parameter symbol min typ. max unit condition luminous flux (2) v ---- 60 ---- lm forward voltage (3) v f ---- 3.55 ---- v wavelength (4) d ---- 527 ---- nm i f =350ma note. 1. tp Q 100 s, duty cycle = 0.25 2. luminous flux measurement tolerance: 10%. 3. forward voltage measurement tolerance: 0.1v. 4. wavelength measurement tolerance: 1nm
ehp-ax08el/sug01h-p01 high power led ? 1 w 4 of 14 luminous flux bin table group bin min typ. max 1 1.5 ---- 3 2 3 ---- 4 3 4 ---- 5 4 5 ---- 6 e 5 6 ---- 8 1 8 ---- 10 2 10 ---- 13 3 13 ---- 17 4 17 ---- 20 f 5 20 ---- 23 1 23 ---- 27 2 27 ---- 33 3 33 ---- 39 4 39 ---- 45 j 5 45 ---- 52 1 52 ---- 60 2 60 ---- 70 31 70 ---- 75 32 75 ---- 80 33 80 ---- 85 41 85 ---- 90 42 90 ---- 95 43 95 ---- 100 51 100 ---- 110 52 110 ---- 120 k 53 120 ---- 130 group bin min typ. max 11 130 ---- 140 12 140 ---- 150 13 150 ---- 160 21 160 ---- 180 22 180 ---- 200 31 200 ---- 225 32 225 ---- 250 41 250 ---- 275 42 275 ---- 300 51 300 ---- 350 n 52 350 ---- 400 1 400 ---- 500 2 500 ---- 600 3 600 ---- 750 4 750 ---- 1000 r 5 1000 ---- 1300
ehp-ax08el/sug01h-p01 high power led ? 1 w 5 of 14 forward voltage bin table ? fine range group bin min typ. max 1 1.75 ---- 1.85 2 1.85 ---- 1.95 u1 3 1.95 ---- 2.05 1 2.05 ---- 2.15 2 2.15 ---- 2.25 u2 3 2.25 ---- 2.35 1 2.35 ---- 2.45 2 2.45 ---- 2.55 u3 3 2.55 ---- 2.65 1 2.65 ---- 2.75 2 2.75 ---- 2.85 u4 3 2.85 ---- 2.95 group bin min typ. max 1 2.95 ---- 3.05 2 3.05 ---- 3.15 v1 3 3.15 ---- 3.25 1 3.25 ---- 3.35 2 3.35 ---- 3.45 v2 3 3.45 ---- 3.55 1 3.55 ---- 3.65 2 3.65 ---- 3.75 v3 3 3.75 ---- 3.85 1 3.85 ---- 3.95 2 3.95 ---- 4.05 v4 3 4.05 ---- 4.15 1 4.15 ---- 4.25 2 4.25 ---- 4.35 v5 3 4.35 ---- 4.45
ehp-ax08el/sug01h-p01 high power led ? 1 w 6 of 14 wavelength bin table group bin min typ. max 3 440 ---- 445 4 445 ---- 450 5 450 ---- 455 6 455 ---- 460 7 460 ---- 465 b 8 465 ---- 490 1 490 ---- 495 2 495 ---- 500 3 500 ---- 505 4 505 ---- 510 5 510 ---- 515 c 6 515 ---- 520 1 520 ---- 525 2 525 ---- 530 3 530 ---- 535 4 535 ---- 540 5 540 ---- 545 g 6 545 ---- 550 group bin min typ. max 1 580 ---- 582.5 2 582.5 ---- 585 3 585 ---- 587.5 4 587.5 ---- 590 5 590 ---- 592.5 a 6 592.5 ---- 610 3 610 ---- 615 4 615 ---- 620 5 620 ---- 625 6 625 ---- 630 7 630 ---- 635 r 8 635 ---- 640
ehp-ax08el/sug01h-p01 high power led ? 1 w 7 of 14 relative spectral distribution, i f =350ma, t soldering =25oc forward voltage vs . forward current, t soldering =25oc relative luminous intensity vs . forward current, t soldering =25oc forward current derating curve, derating based on t j max =125 c typical electro-optical characteristics curves 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous intenstiy wavelength(nm) 0 100 200 300 400 500 2.6 2.8 3.0 3.2 3.4 3.6 3.8 forward voltage (v) forward current (ma) 0 100 200 300 400 500 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 relative luminous intensity forward current (ma) 0 20 40 60 80 100 100 150 200 250 300 350 400 soldering temperature ( o c ) forward current (ma)
ehp-ax08el/sug01h-p01 high power led ? 1 w 8 of 14 typical representative spatial radiation pattern note. 1. 2 1/2 is the off axis angle from lamp centerline where th e luminous intensity is 1/2 of the peak value. 2. viewing angle tolerance is 10 . -80 -60 -40 -20 0 20 40 60 80 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 relative luminous intensity degree (2 )
ehp-ax08el/sug01h-p01 high power led ? 1 w 9 of 14 label explanation cpn: customer?s production number p/n : production number qty: packing quantity cat: rank of luminous flux hue: color rank ref: rank of forward voltage lot no: lot number made in taiwan: production place tube packing specifications 1. tube 2. inner carton 3. outside carton packing quantity 1. 50 pcs / per tube 2. 20 tubes / inner carton 3. 12 inner cartons / outside carton
ehp-ax08el/sug01h-p01 high power led ? 1 w 10 of 14 reliability data stress test stress condition stress duration reflow tsol=260 , 10sec, 6min 3 times thermal shock h 100 20min. ' 10sec. 'l 10 20min. 300 cycles temperature cycle h 85 30min. ' 5min. 'l 40 30min. 300 cycles high temperature/humidity operation ta=85 , rh=60%, if=225ma 1000hours room temperature operation life ta=25 , if=350ma 1000hours high temperature operation life #1 ta=55 , if=350ma 1000hours high temperature operation life #2 ta=85 , if=225ma 1000hours low temperature operation life ta=-40 , if=350ma 1000hours failure criteria : 1. leds are open or shorted 2. lm: luminous flux attenuate difference(1000hrs)> 50% 3. vf: forward voltage difference(1000hrs)>20%
ehp-ax08el/sug01h-p01 high power led ? 1 w 11 of 14 precautions for use over-current-proof although the ehp-ax08 series has a conductive esd p rotection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. otherwise, slight voltage shifts may cause significant current change resulting in burn out failure. 1. storage i. do not open the moisture proof bag before the de vices are ready to use. ii. before the package is opened, leds should be st ored at temperatures less than 30 and humidity less than 50%. iii. leds may be stored for 6 months. when the stor age time has reached more than 6 months, leds should be stored in a sealed container filled with the nitrogen gas. iv. after the package is opened, leds should be sto red at temperatures less than 30 and humidity less than 30%. v. leds should be used within 168 hours (7 days) af ter the package is opened. vi. before using leds, baking treatment should be i mplemented based on the following conditions: pre-curing at 605 for 24 hours. 2. thermal management i. for maintaining the high flux output and achievi ng maximum reliability, ehp-ax08 series leds should be mounted on a metal core print ed circuit board (mcpcb) or other kinds of heat sink with proper thermal connection t o dissipate approximately 1w of thermal energy at 350ma operation. ii. heat dissipation or thermal conduction design i s strongly recommended on pcb or mcpcb for reflow soldering purposes. please refer t o soldering patterns on page 2. iii. sufficient thermal management must be implemen ted. please refer to the graph ?forward current derating curve ? on page 7. the so ldering temperature must be kept under 60 at the driving current 350ma . otherwise, the junction temperature of die may exceed over the limit at high current driving c onditions and the leds? lifetime may be decrease dramatically. iv. special thermal designs are also recommended to take in outer heat sink design, such as fr4 pcb on aluminum with thermal vias or fpc on aluminum with thermal conductive adhesive, etc. v. sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving an d led lifetime will decrease critically. .
ehp-ax08el/sug01h-p01 high power led ? 1 w 12 of 14 3. proper handling to avoid contamination of materials, damage of inte rnal components, and shortening of led lifetime, do not subject leds to conditions as those listed below. bare hand t weezers when handling the product, do not apply direct pressure on the resin. do not touch the resin to avoid scratching or other damage. pick and place nozzle for surface mount assembly. during module assembly avoid directly contacting the lens with nozzle. do not stack the modules together, it could damage the resin or scratch the lens.
ehp-ax08el/sug01h-p01 high power led ? 1 w 13 of 14 4. soldering iron i. for reflow process a. ehp-ax08 series are suitable for smt process. b. curing of glue in oven according to standard ope ration flow processes. c. reflow soldering should not be done more than tw ice. d. in soldering process, stress on the leds during heating should be avoided. e. after soldering, do not warp the circuit board. ii. for manual soldering process a. for prototype builds or small series production runs it is possible to place and solder the led by hand. b. dispense thermal conductive glue or grease on th e substrates and follow its curing specifications. gently press led housing to closely connect led and substrate. c. it is recommended to hand solder the leads with a solder tip temperature of 280c for less than 3 second, at a time with a soldering iron of less than 25w. solder at intervals of two seconds or more. d. take caution and be aware that damaged products are often a result of improper hand soldering technique.
ehp-ax08el/sug01h-p01 high power led ? 1 w 14 of 14 revision history page subjects(major change in previous version) date of change 2,3,7,9 1. revision dc operating current 2. t ambient revision is t soldering 3. change the map surface 4. change package quantity 2009/10/08 prepared date: 08-oct-2009 device no.: dhe-0000586 created by: jill yen rev.: 2 for product information and a complete list of dist ributors, please go to our web site www.everlight.com everlight electronics co., ltd. and the logo are trad emarks of everlight electronics co., ltd. in the taiwan and other countr ies. data subject to change. copyright ? 2005-2009 everlight electronics co., ltd. . all rights reserved.

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